TSMC approved a new capital budget of about $29.443 billion on August 11 to expand advanced process and advanced packaging capacity as AI and high-performance computing demand drives heavier spending. Together with the $31.283 billion cleared in May, the year's approved budget now totals $60.726 billion, or about NT$1.96 trillion. TSMC Chairman C.C. Wei said in July that 13 advanced wafer fabs and advanced packaging plants will continue to be built in Taiwan, spanning Kaohsiung, Hsinchu Baoshan and Tainan, while the company's Arizona investment rises to $26.5 billion. The board also approved a joint venture with Sony Semiconductor Solutions Corporation in Kumamoto Prefecture, Japan, with TSMC's investment capped at 282 billion yen and mass production of next-generation smartphone image sensors targeted by 2029. It also declared a NT$7 per share cash dividend for the second quarter, with an ex-dividend date of December 10 and a U.S. dollar payout option for eligible foreign shareholders.