MediaTek is extending its semiconductor design business from mobile and PC system-on-chips into customized data-center processors through a collaboration with NVIDIA. Its Dimensity CX C10 Max, built on TSMC’s 3-nanometer-class process, targets Google’s AI laptop platform and combines Arm CPU and GPU cores with an NPU capable of 55 TOPS. On August 31, MediaTek secured a $3.5 billion convertible bond investment from NVIDIA and adopted the NVLink Fusion interconnect standard to develop customized XPUs for hyperscalers including Google and Amazon. MediaTek expects about $2 billion in data-center-customized semiconductor revenue this year and aims to capture up to 15% of an AI data-center market projected at $80 billion next year. The expansion is widening the contrast between Taiwan’s integrated design-and-foundry ecosystem and Samsung Electronics’ more limited commercial design footprint, industry observers say.