Innova Q2 profit jumps 142.41% as AI packaging demand lifts July revenue to record

Innova Technologies reported a sharp rise in second-quarter earnings as semiconductor customers accelerated investment in advanced packaging capacity for generative AI and high-performance computing. Net profit attributable to the parent company reached NT$389 million in the quarter, up 142.41% from a year earlier, while earnings per share rose to NT$14.04. Revenue for the period climbed 48.32% year-over-year to NT$913 million, with gross margin at 67.31% and operating margin at 53.5%. The momentum extended into July, when revenue reached a record NT$409 million, up 77.8% from the previous month and 62.33% from a year earlier. For the first seven months, cumulative revenue totaled NT$2.2 billion, up 62.94% year-over-year. Innova said demand was supported by faster shipments, tool move-in and customer acceptance for high-end equipment including high-pressure vacuum de-voiding and WSAS warpage suppression systems, as major wafer foundries and OSAT providers (outsourced semiconductor assembly and test companies) expanded production lines. First-half revenue totaled NT$1.79 billion, up 63.09% year-over-year, while net profit attributable to the parent company rose 106.04% to NT$797 million and EPS reached NT$28.72. Revenue, operating profit and net profit for the first half all set record highs. The company identified its second-generation VTS process de-void system as the main growth driver, reflecting rising demand for CoWoS, chiplet packaging and large-format AI chip packaging, where tighter packaging density makes bubble and void control more difficult. The company is also positioning for next-generation packaging technologies including CoPoS and silicon photonics. It said CoPoS has moved into a key phase of equipment and material qualification this year, with its WSAS module aimed at improving warpage control, yield and production stability for larger packages. In silicon photonics and CPO (co-packaged optics), Innova has introduced its fourth-generation EvoRTS system to combine flux residue control and void elimination on one platform. Industry sources said the company has clear order visibility and a defined growth path as AI-led semiconductor capacity expansion continues.

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