Taiwan Semiconductor Manufacturing Co. shares rose alongside the broader chip sector Friday after Broadcom enlisted banks to arrange close to $60 billion in financing for AI chip purchases. The package includes a $42 billion senior-secured tranche and an $18 billion junior-debt portion led by Blackstone, which is committing $9 billion and placing the remainder with other investors. The financing would give Anthropic and similar AI companies more capacity to purchase chips and computing equipment, while supporting sales of Broadcom’s chips and data-center gear as it competes with Nvidia. Broadcom declined to comment on the report. Separately, Samsung is quoting mid-to-high $4 per gigabit for 2027 HBM4 supply, about three times the roughly $1.50 charged for current HBM3E chips. Samsung says its HBM4 can reach transfer speeds of 13 gigabits per second, which the report says no other industry player has matched. TSM manufactures chips for Broadcom and Nvidia, making it a direct beneficiary of continued AI infrastructure spending. Its shares were up 2.64% at $471.32 at publication and traded near the 52-week high of $479.00, according to Benzinga Pro.