TSMC has started operating its first Chip-on-Panel-on-Substrate, or CoPoS, production line at its AP7 advanced packaging site in Chiayi, Taiwan, and is also reportedly in advanced talks to buy two AUO plants in the Central Taiwan Science Park for more than NT$30 billion, roughly $920 million to $930 million. Economic Daily News said the AP7 line is using a 310mm x 310mm panel and has entered core testing and commercialization verification, with about a year still needed to stabilize the technology and yields. The reported AUO deal would cover the L7 Plant and L5C Plant next to TSMC's Fab 15 complex, potentially giving TSMC scarce cleanroom space and power capacity as it expands glass-substrate-based packaging for larger AI chips. TSMC and AUO both said they do not comment on market rumors or speculative reports.