Sony Semiconductor Solutions and Taiwan Semiconductor Manufacturing Co. have formalized a $4.69 billion joint venture in Kumamoto, southern Japan, to develop and manufacture next-generation smartphone image sensors, with volume production targeted for 2029. Sony will control the business and invest about $2.92 billion through cash and asset transfers, including its new Kumamoto chip factory, while TSMC will invest roughly $1.77 billion. The deal advances a partnership first outlined in May and deepens both companies' manufacturing footprint in Japan even after a late-July magnitude-7.1 earthquake disrupted the region's semiconductor industry. Earlier reporting had described a roughly 1 trillion yen framework, while the definitive agreement sets planned investment at 747 billion yen and had indicated the venture could also seek additional financing alongside expected Japanese government support.