OCI Holdings is increasing solar-wafer output by using wafer-thinning technology at Neo Silicon Technologies in Vietnam, cutting wafer thickness to 110 microns from 130 microns and raising annual capacity to 3.75 gigawatts next year from 2.7 gigawatts without new line investment. The roughly 39% gain allows more wafers to be produced from the same silicon, lowering polysilicon use per unit and indicating demand is strong enough to justify higher output rather than simple material savings. Industry sources and Eugene Investment & Securities linked the move to the requirements of a customer believed to be a global space company, aligning with OCI's push into the space solar market, with market speculation centered on SpaceX or Tesla, though OCI declined to comment. The company also plans staged wafer expansion to 7.5 gigawatts in 2028 and 11.5 gigawatts in 2029, while its polysilicon business is preparing a 35-kiloton expansion toward a 70-kiloton system by 2029 and says most added volume already has sales channels. Existing polysilicon output is sold out under a new U.S. LTA, most 2029 wafer volume is already covered by advance LTAs, and analysts say a new U.S. Section 232 minimum import price for polysilicon and derivative products could lift prices by restricting indirect inflows of lower-cost Chinese material. Kiwoom Securities said a 10% to 15% rise in polysilicon ASP could add about 100 billion won, or roughly $70.6 million, to annual operating profit, while Eugene analyst Hwang Sung-hyun said easing policy uncertainty should support new sales and more LTA talks in the second half.