ResearchAndMarkets.com has added a report on the global co-packaged optics market covering 2027 to 2037, outlining how co-packaged optics is being positioned as a core interconnect technology for AI data centres, hyperscale infrastructure and high-performance computing. The study says placing optical engines next to switch or accelerator silicon shortens electrical paths from centimetres to millimetres, improving power efficiency, bandwidth density and latency relative to pluggable transceivers. It identifies two main segments: scale-out CPO for network-switch optical engines and scale-up CPO for GPU and AI-accelerator optical I/O (input/output). Initial use is expected in the highest-bandwidth network switches, with scale-up deployments projected to accelerate as next-generation GPU and AI-accelerator platforms enter production and potentially overtake scale-out CPO later in the decade. The report highlights industry activity including NVIDIA investments in Coherent and Lumentum, TSMC's COUPE roadmap, GlobalFoundries' OCI-MSA-aligned SCALE platform, Ayar Labs joining NVIDIA's NVLink Fusion ecosystem, Marvell's acquisition of Celestial AI, and Fabrinet's investment in Raytek Semiconductor. It also says the OCI-MSA (optical interconnect industry group), backed by AMD, Broadcom, Meta, Microsoft, NVIDIA and OpenAI, has emerged as a leading scale-up standard. At the same time, the study warns that large-scale NVIDIA CPO production could shift to 2028-2029 because of serviceability, reliability, manufacturing-test yield and broader systems-engineering challenges, with near-package optics seen as an intermediate step. Forecasts span 2026 through 2037 across applications, switch bandwidth generations, integration technologies, components and regions, with bull, base and bear scenarios, probability assessments, unit volumes, pricing trajectories and total-cost-of-ownership analysis.