MediaTek shares fell more than 4% intraday on Aug. 17 after a SemiAnalysis report tied Google's TPU roadmap to both a possible AMD partnership on the 10th-generation program and lower shipment expectations for several Broadcom-designed TPU products because of CoWoS-S packaging constraints. By 11:18 a.m., MediaTek was down 3.44% at NT$4,065 after earlier falling as much as 3.92% to NT$4,045, while Broadcom had dropped 5.94% on Aug. 14 to $392.99, its lowest close since Aug. 3. The report said Google may lean on AMD's CPU IP, packaging and interconnect capabilities in a hybrid AI ASIC design as customers seek tighter CPU integration for reinforcement learning and inference workloads, while Broadcom's Google-related ASIC programs face lower 2026 and 2027 production estimates. Full-year 2026 output for TPU v7 Ironwood was cut to about 2.7 million units from 3.2 million, and TPU v8i Sunfish was also revised lower. Broadcom sentiment was also hit by reports that a VMware vCenter flaw, CVE-2026-59310, had been exploited. Even with the near-term pressure, investors continue to watch MediaTek's AI ASIC push, including volume production of its first AI accelerator in the fourth quarter and a possible role in later Google TPU generations.