Trane Technologies and Eaton Corporation have introduced a combined power and cooling system for AI data centers, extending their push into infrastructure for high-density GPU facilities. The companies said the integrated design is based on NVIDIA’s DSX AI Factory Reference Design and is intended to support higher-power AI data centers while speeding development. The joint solution combines Trane’s thermal management portfolio with Eaton’s power infrastructure and, according to the companies, can improve energy efficiency by up to 15%, lower installation costs by up to 30% and reduce copper use by up to 80%. Those gains matter as AI workloads drive higher rack densities, larger power requirements and more complex cooling needs than traditional data center deployments. Trane has said its hyperscale portfolio includes coolant distribution units with up to 14 MW of liquid cooling capacity. The company has also worked with NVIDIA using the Omniverse digital-twin modeling platform, a collaboration that produced nearly a 10% improvement in thermal performance for AI-focused workloads. Trane recently completed its acquisition of LiquidStack, which specializes in immersion and direct-to-chip cooling. Eaton has been building HVDC systems for high-density GPU environments and said the architecture can cut losses created when alternating current is repeatedly stepped down and converted before reaching server chips. Eaton also acquired Boyd Thermal for $9.5 billion, expanding its liquid cooling and thermal solutions portfolio.