ResearchAndMarkets.com has added "The Global DRAM Market 2026-2036" to its offering, presenting a 496-page analysis that says artificial intelligence demand is driving a structural shift in memory. The report says High-Bandwidth Memory, or HBM, has become central to AI accelerators from Nvidia, AMD, Google and major hyperscalers, with supply tight since 2023 and likely to remain constrained into the latter half of the decade. It forecasts total DRAM market revenue will approach $400 billion by 2027, while also highlighting growth in conventional DRAM products such as DDR5, LPDDR5X and GDDR7, broader reliance on advanced packaging and manufacturing technologies including EUV lithography, and a longer-term transition toward 3D DRAM in the 2032-2035 timeframe. The study examines competition among Samsung Electronics, SK hynix and Micron Technology, as well as China's domestic efforts led by CXMT and JHICC under U.S. export-control constraints.