Topco Scientific reported record second-quarter and first-half results as AI and high-performance computing demand lifted advanced wafer foundry processes, high-end packaging and memory, with first-half EPS rising 52.6% year over year to NT$14.79. The company said it holds about 80% share in advanced-process quartz products and has order visibility through 2030, supporting a July land purchase next to its Puzi plant for capacity expansion. Management said advanced wafer foundry and memory fab utilization rates have climbed to 95% to 100%, silicon wafer supply is tightening, and long-term supply agreement renewals are under way. It also said prices for products such as thermal adhesive materials, fluororubber, photoresist and wafer carriers have risen about 10% to 15% on average, though higher selling prices may not lift gross margins in tandem because the outcome depends on the mix of proprietary products, agency distribution and engineering services. Separately, affiliate Topco Technologies said demand for AI server, thermal management and copper clad laminate materials should make the second half stronger than the first half, even if the third quarter is relatively flat, and said some high-end AI materials have order visibility to 2028.