A new semiconductor price-increase cycle is broadening in the second half of 2026 as demand for AI computing absorbs mature-process capacity and supply-chain costs continue to rise. RF-chip maker Maxscend Microelectronics will apply new prices across its full range of RF products from Sept. 1, while Nationz Technologies plans to raise prices for some MCU products by 10% to 20%. STMicroelectronics is scheduled to complete its third price adjustment of the year on Aug. 23, and ADI will implement its second round of new prices from Sept. 13. The increases span memory, MCUs, RF front ends, power semiconductors, analog chips and passive components. The broader semiconductor squeeze is adding to existing PCB-sector pressure: Kinwong, JINGPENG, Dingying Investment Holdings and YaoHua have raised quotes by about 5% to 30% this year, while major CCL manufacturers increased prices by about 20% to 30% in the first half. Tight supplies of copper foil substrates, semi-cured sheets and high-end electronic fabrics, including a Low DK second-generation fabric supply-demand gap estimated at more than 60%, are expected to keep pressure elevated through the first half of 2027. AI GPU and ASIC demand is also supporting further double-digit price increases for IC substrates in the third and fourth quarters. Together with expanding domestic-substitution demand, the trends are pushing the industry toward a cycle of rising shipments and prices.