Broadcom is facing higher borrowing costs as it considers a potential debt facility exceeding $60 billion to finance custom AI chips for companies including Anthropic, following an earlier $35 billion transaction it backstopped. The development has intensified investor concern about the semiconductor company’s expanding balance-sheet exposure to AI infrastructure. Yields on Broadcom’s 5.15% bonds due in 2031 rose roughly 14 basis points in August, while five-year credit-default swap costs increased 28 basis points, outpacing comparable moves for Oracle and SpaceX. Broadcom shares fell 2.63% to $358.76 on Monday. The latest proposal follows earlier reports that the company was weighing a $70 billion to $80 billion package, potentially comprising approximately $45 billion of senior debt and $35 billion of subordinated debt, although the final size and structure remain unsettled. The financing model uses special purpose vehicles and leased compute infrastructure to accelerate chip sales while allowing AI companies to access capacity without funding construction upfront. Analysts warn that leases, purchase commitments, residual-value guarantees and other credit support could create substantial off-balance-sheet obligations. Bank of America estimates Broadcom’s senior debt could reach approximately $370 billion by 2029 if its platform scales as planned. Credit analysts say the rising CDS cost may reflect concern about Broadcom’s own balance sheet more than a broad retreat from AI investment, leaving investors focused on the company’s ultimate guarantee exposure.