Goldman Sachs raises 2026-2028 wafer equipment forecasts as AI memory bottlenecks deepen

Goldman Sachs raised global wafer fab equipment spending forecasts for 2026, 2027 and 2028 to $150 billion, $218 billion and $281 billion, respectively, lifting projected growth to 36%, 45% and 29%. Foundry and DRAM are the main drivers, supported by stronger-than-expected semiconductor capital-expenditure data, optimistic equipment-supplier guidance, advanced TSMC N2 production and sustained AI-related memory demand. Nvidia has separately notified major enterprise customers and cloud providers, including Microsoft, Google and Oracle, that flagship AI server systems shipping from early 2027 could cost more than 15% because HBM and server DRAM remain scarce. The higher costs may encourage hyperscalers to expand custom chips for inference and other predictable workloads.

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Goldman Sachs raises 2026-2028 wafer equipment forecasts as AI memory bottlenecks deepen - CoinPost Terminal