Xiaomi unveils Xring O3 chip for flagship foldable phone

Xiaomi unveiled its Xring O3 smartphone processor as the Chinese tech company intensifies a years-long push toward chip independence. Built on TSMC’s enhanced 3-nanometre process, potentially the N3P variant, the chip is expected to power an upcoming flagship foldable phone, with initial production shipments targeted at 200,000 to 300,000 units. The O3 follows the Xring O1, which Xiaomi launched in May 2025 and which became the first 3-nanometre smartphone processor designed by a Chinese company. Devices using the O1, including smartphones, tablets and watches, have shipped more than 1 million units in total, while about 150,000 O1 smartphones were sold, according to sources. Xiaomi has assigned more than 2,500 engineers to its chip program, underscoring the scale and long-term nature of its effort to reduce dependence on Qualcomm and MediaTek and strengthen supply-chain resilience.

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