CXMT has reportedly advanced its LPDDR6 low-power DRAM toward commercial supply for Xiaomi’s next-generation XRING O3 flagship processor, potentially making it the first Chinese memory product used in a high-end mobile platform alongside South Korean suppliers. Xiaomi’s next-generation flagship foldable phone is expected to use the in-house XRING O3 and CXMT’s LPDDR6, with reported shipments of about 200,000 to 300,000 units. CXMT began sending samples to core customers in March, reached final validation in August and has since progressed toward mass production. Its 16Gb-per-die, 16GB-per-package memory runs at 10.7Gbps normally and up to 12.8Gbps, below the 14.4Gbps offered by Samsung Electronics and SK Hynix, but its Package-on-Package design is close to international form-factor standards. The development highlights China’s rapid catch-up in mobile DRAM as South Korean companies prioritize higher-margin HBM for artificial-intelligence infrastructure, while geopolitical restrictions and equipment-maintenance risks remain potential constraints on CXMT’s production expansion.