E&R Engineering Corp. (Taipei Exchange: 8027) will showcase semiconductor laser and plasma processing equipment at SEMICON Taiwan 2026 in Taipei from Sept. 2 to 4. Its exhibits will include five-axis laser drilling for Fiber Array Units (FAUs), which are optical component assemblies, supporting 2D configurations with bandwidths of 3.2 Tbps, 6.4 Tbps and 12.8 Tbps and drilling accuracy of ±0.5 μm. The company will also present processing for Glass Core substrates, Through-Glass Via (TGV) structures, Glass Carriers and large-format glass panels, alongside the PHB-600A laser system and R-300R Hybrid Plasma System. The R-300R uses independently controlled microwave and radio-frequency power sources for surface activation, cleaning, descum, de-smear and deep silicon etching. E&R says its integrated laser and plasma platform supports semiconductor manufacturing, advanced packaging, optical communications, glass processing and precision micromachining from research and development validation through production-scale development.