TSMC’s CoWoS remains the safest and most flexible platform for combining AI accelerators with HBM, but rising costs, capacity constraints and concerns over final-stage yield are encouraging chip designers to consider second sources. Intel’s EMIB technology is already in volume production and is expected to package Google’s next-generation TPU developed with MediaTek, while Powertech Technology is preparing a panel-level packaging alternative for ASICs and HBM. Google’s earlier EMIB-based TPU reportedly met its targets for yield, technology, cost and capacity, increasing the likelihood of continued use. The shift could improve customers’ bargaining power and diversify supply chains, although analysts say TSMC’s current CoWoS yields remain excellent and there is no evidence of a systemic yield crisis.