SK Hynix held a groundbreaking ceremony for an advanced packaging and research facility at Purdue Research Park in West Lafayette, Indiana, as the South Korean chipmaker expands U.S. capacity for memory used in artificial-intelligence systems. The project, now valued at more than $4 billion, will include a next-generation high-bandwidth memory (HBM) packaging line and an AI semiconductor research and development facility. Cleanroom operations are scheduled to begin in the second half of 2028. HBM is specialized memory that stacks chips vertically to accelerate data processing while using less power, making it important for AI data centers. SK Hynix said the facility and related supply-chain investment could support about 7,000 direct and indirect local jobs. The project received $458 million in U.S. government grants and up to $500 million in loans under the CHIPS Act in December 2024. SK Hynix held 58% of the global HBM market by revenue in the first quarter of 2026, compared with 21% each for Samsung Electronics and Micron Technology, according to Counterpoint Research.