Chinese memory chipmaker ChangXin Memory Technologies will supply its latest LPDDR6 DRAM chips for Xiaomi’s upcoming 18 Fold flagship foldable smartphone, scheduled for release in September. CXMT said on Weibo that it has begun mass production of LPDDR6, while Xiaomi confirmed the arrangement through its official Weibo account. The chips will support Xiaomi’s new internally developed 3-nanometer Xring O3 smartphone processor. The move marks a rapid technology advance for CXMT and narrows its gap with global memory makers including Samsung Electronics and SK Hynix. The agreement comes as CXMT reported an 874% year-on-year increase in first-half revenue to 150.3 billion yuan ($22.36 billion), swung sharply to profit and disclosed shipments of LPDDR6 samples for mobile devices, servers and smart cars. Separately, CXMT sued the U.S. Department of Defense over its inclusion on a list of companies Washington says are linked to China’s military, amid continuing U.S.-China tensions over advanced semiconductor technology.