SEMICON Taiwan 2026 will run Sept. 2–4 at Taipei Nangang Exhibition Center under the theme "Transform Tomorrow," with more than 1,300 exhibitors from 65 countries across 4,300 booths and more than 100,000 participants expected. More than 50 international forums, beginning Aug. 31, will examine AI infrastructure, advanced processes, heterogeneous integration, advanced packaging, quantum computing, smart manufacturing and chiplet architecture. SEMI projects global semiconductor revenue will surpass $1.5 trillion this year and could reach $2 trillion by 2030, while the global semiconductor materials market is forecast to reach $92 billion by 2027, with Taiwan accounting for about 30%. The event’s full-day CEO Summit will feature leaders from across Taiwan’s AI supply chain, while Amin Vahdat, Google’s senior vice president of AI and infrastructure and chief technologist, will deliver the opening keynote. Speakers say AI is moving advanced packaging and heterogeneous integration toward the center of system architecture, with Taiwan benefiting from coordination across design, manufacturing, packaging, testing, materials and system applications. New exhibition areas will cover quantum technology, wafer-fab intelligence, chiplets and startups, while capital-market research is highlighting rapid growth in Micro LED and sustained demand for semiconductor facilities and equipment.