SK Hynix increased silicon wafer procurement 104% quarter-over-quarter in the second quarter, far outpacing Samsung Electronics as it prepares for next-generation HBM4 production. The buildup reflects expectations of higher wafer prices and the need to prevent material shortages from constraining HBM and advanced DRAM capacity. Strong first-quarter results, including revenue of ₩52.58 trillion and operating profit of ₩37.61 trillion, have supported the strategy. SK Hynix has nearly doubled its 1C DRAM expansion target to 170,000–200,000 wafers per month by the end of the first quarter of 2027, plans to invest $4 billion in an Indiana HBM packaging facility, and has completed development of 16GB LPDDR6 on the 1c node and validation of 375-layer NAND production. The company has also allowed selected tier-one equipment suppliers to raise prices by 3%–4%, ending a five-year practice of seeking price reductions. Separately, SK Hynix is reportedly evaluating Intel Foundry as a possible second supplier for HBM4E base dies and packaging, alongside TSMC, although it has said some reported details were inconsistent with the facts and has not confirmed its technology roadmap.