The global data-center liquid-cooling manifolds market is projected to expand from $0.94 billion in 2026 to $6.33 billion by 2033, representing a 31.2% compound annual growth rate. Demand is being driven by artificial intelligence, machine learning, high-performance computing, hyperscale cloud infrastructure and high-density GPU deployments, which are producing thermal loads beyond the practical capabilities of conventional air cooling. Manifolds distribute and regulate coolant across servers, racks, cold plates and broader cooling loops, supporting direct-to-chip, immersion and hybrid architectures. In-rack manifolds are both the largest and fastest-growing manifold segment, with a projected 33.6% CAGR, while direct-to-chip cooling holds the largest technology share and immersion cooling is expected to grow fastest. North America is forecast to be the fastest-growing region, at a 32.3% CAGR. Hyperscale data centers, stainless-steel manifolds, aisle-mounted designs and new installations are the leading segments by market position. Key challenges include capital and deployment costs, leakage concerns, maintenance complexity, reliability risks and limited standardization across vendors. CoolIT Systems, Vertiv Group Corp., Parker Hannifin Corp., nVent Electric plc and GF Industry & Infrastructure Flow Solutions are identified among the leading players. Ecolab's acquisition of CoolIT Systems in March 2026 and Eaton's announced acquisition of Boyd's thermal management business that month underscore increasing strategic activity in the sector.