Samsung Electronics has reportedly committed about 70% of its memory production capacity to long-term supply agreements (LTAs) running through 2031, as AI accelerator demand intensifies competition for high-bandwidth memory (HBM). Spot HBM prices have risen to as much as five times LTA levels, drawing buyers without contracted supply into the spot market. KITA data showed DRAM export volumes used in AI chip production fell 13.2% from May to July, while export value increased 18.5% and unit prices climbed 36.6%. The shift reflects the early mass production of HBM4, whose lower yields and higher prices consume more wafers than HBM3E. Samsung and SK Hynix are reviewing or pursuing additional production capacity, while analysts expect both companies to post record third-quarter results.