Samsung unveils CUBE 3D memory strategy at Semicon Taiwan 2026

  • Samsung Electronics presented its CUBE strategy for three-dimensional memory at Semicon Taiwan 2026.
  • SEMI forecasts the global semiconductor market will surpass $2 trillion by 2030.
  • TSMC is promoting its Compact Universal Photonic Engine optical packaging platform.

Samsung Electronics presented its CUBE strategy at Semicon Taiwan 2026 on Sept. 1, outlining a three-dimensional memory approach designed to increase capacity, improve data-processing speed and reduce the energy required to move data. CUBE stands for Capacity, Utilization, Bandwidth and Efficiency. The strategy reflects a broader semiconductor race to integrate memory, logic, optical communications and advanced packaging as AI workloads intensify. TSMC is promoting its Compact Universal Photonic Engine, or Coupe, while the industry develops silicon photonics and co-packaged optics to replace conventional electrical links. SEMI forecasts that the global semiconductor market will surpass $2 trillion by 2030, with this year's Semicon Taiwan expected to draw more than 100,000 attendees across 4,300 booths operated by over 1,300 companies.

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