Germany and Taiwan are broadening semiconductor cooperation beyond fab investment as the European Semiconductor Manufacturing Company (ESMC) Dresden plant, a joint venture involving Taiwan Semiconductor Manufacturing Co. (TSMC), progresses on schedule toward production by the end of 2027. The facility is planned to use 28/22nm and 16/12nm technologies for automotive and industrial applications, supported by customer demand commitments. The partnership comes as Germany seeks to strengthen trusted technology supply chains with democratic partners including Japan, South Korea, the United States and Taiwan amid geopolitical tensions involving China.