Zhen Ding, Hanmi and Hanwha unveil AI interconnect and packaging equipment

Sep 2, 2026 04:26 (20d ago)

Zhen Ding, Hanmi Semiconductor and Hanwha Semiconductor presented separate AI interconnect and advanced-packaging strategies at SEMICON Taiwan 2026.
Zhen Ding displayed 1.6T optical modules and 34-layer server boards, while Hanwha debuted 600×600mm FOPLP equipment and Hanmi showed five 2.5D models.
Zhen Ding cited a PCB market above $140 billion by 2030, while both equipment makers are expanding beyond established HBM businesses.

Zhen Ding Technology Holding (4958.TW), Hanmi Semiconductor and Hanwha Semiconductor presented separate technology roadmaps at SEMICON Taiwan 2026, addressing AI infrastructure requirements from high-speed interconnects to chip packaging. Zhen Ding showcased 800G and 1.6T optical modules and AI server boards with up to 34 layers. Hanmi unveiled five 2.5D packaging equipment models extending its HBM thermal-compression-bonder business into systems integrating GPUs, CPUs and HBM through silicon interposers. Separately, Hanwha Semiconductor made its 600×600mm SFM5 Square fan-out panel-level packaging equipment debut and displayed hybrid-bonding, 3D HBM and 2.5D chip-on-wafer systems. The companies are targeting growing demand for higher bandwidth, integration and production efficiency in AI semiconductors, with Zhen Ding citing a global PCB market expected to exceed $140 billion by 2030 and institutional investors seeing demand visibility through 2027.