Hanwha Semiconductor is showcasing its SFM5 Square fan-out panel-level packaging (FOPLP, chip packaging on square panels) equipment for the first time at SEMICON Taiwan 2026 in Taipei. Based on 600×600mm panels, the system is designed to reduce the edge waste associated with circular wafers and increase chip output from the same surface area. The company is presenting four advanced packaging systems at the Nangang Exhibition Center from the 2nd through the 4th, including the SHB2 Nano hybrid bonder, the SFM5 Expert 3D thermal compression bonder for HBM, and the SFM5 TnR 2.5D chip-on-wafer bonder. Hanwha Semiconductor said it plans to build on its HBM thermal-compression-bonding business by entering CoW, hybrid bonding and FOPLP, while pursuing global customers and wider cooperation with semiconductor manufacturers as demand for AI packaging grows. More than 1,300 companies, including Lam Research and Tokyo Electron, are participating in this year's SEMICON Taiwan.