Taiwan Semiconductor Manufacturing Co. is building about 20 wafer fabs and advanced-packaging facilities worldwide but still cannot keep pace with artificial-intelligence chip demand, Hou Yongqing, a senior vice president and chairman of the Taiwan Semiconductor Industry Association, said at the Semicon Taiwan 2026 CEO Summit in Taipei. He said demand has changed more sharply and frequently than at any point in 30 years, while equipment purchasing demand in July reached 1.9 times its level at the end of 2025. TSMC is advancing 13 fabs in Taiwan and five to six overseas, compared with four or five projects previously handled at once. Hou said the main constraint is a shortage of skilled construction and installation workers rather than capital. Buildings must still be fitted with cleanrooms, specialty-gas and utility systems, maintenance infrastructure, production tools and packaging lines before output can begin. TSMC raised its 2026 capital-spending plan to $60 billion-$64 billion and increased its cumulative U.S. investment commitment to $265 billion. The foundry market grew 29% year on year, while TSMC held a 73% share for a second consecutive quarter. Tight supply is likely to persist for leading-edge nodes and CoWoS advanced packaging as equipment, labor and production capacity remain constrained.