Synopsys cuts AI chip die area 22% with Samsung's 2nm process

  • Samsung Electronics and Synopsys are expanding cooperation across Samsung's advanced foundry processes.
  • Synopsys reduced an NPU's die area 22% using Samsung's SF2P 2nm process.
  • Synopsys also works with Samsung System LSI on all Exynos mobile programs.

Synopsys reduced the die area of an AI neural processing unit by 22% by combining its design tools with Samsung Electronics' SF2P 2nm process, highlighting the benefits of design-technology co-optimization (jointly optimizing chip design and manufacturing). The result was unveiled at Synopsys Converge Korea 2026 in Seoul, the first South Korean showcase of integrated Synopsys and Ansys technology since Synopsys acquired the simulation software company last year. Synopsys said its cooperation with Samsung now covers all of Samsung Foundry's advanced processes and includes Samsung System LSI's Exynos mobile application-processor programs. The combined platform extends from semiconductor design and verification to multiphysics simulation, while AgentEngineer uses AI agents to connect and automate workflows. Synopsys is expanding its South Korean business beyond memory into foundry, mobile and AI-chip projects, including work with Rebellions and FuriosaAI. The company also said it would not raise tool or licensing prices artificially because of the Ansys acquisition and would expand its ASK government collaboration program to semiconductors.

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