Samsung Electronics opened an advanced packaging research center in Yokohama on Tuesday, bringing its AI-chip development closer to Japanese suppliers that hold strong positions in semiconductor equipment and materials. The facility will focus on back-end processes that integrate multiple chips into high-performance units, an increasingly important technology as transistor scaling slows and AI computing demand grows. The center builds on Samsung’s broader Advanced Package Lab, which began full-scale operations this month with approximately 6,600 square meters of space, a semiconductor-grade cleanroom and about 95 Japanese and South Korean researchers. The Japanese government plans to invest up to ¥20 billion, approximately $129.9 million, through 2028 from a semiconductor fund administered by the Ministry of Economy, Trade and Industry. More than 50 Japanese companies are participating in the research effort, including Tokyo Electron and Ibiden, while the new account highlights Tokyo Electron, Disco and Resonac as important suppliers for advanced packaging tools and materials. Samsung aims to shorten development cycles, improve high-performance packaging and strengthen its position against Taiwan Semiconductor Manufacturing and Intel. Separately, Samsung plans to unveil a humanoid robot prototype at CES 2027 in Las Vegas next January. The effort follows consumer robotics showcases such as Ballie and Samsung’s move to become the largest shareholder in Rainbow Robotics, although the company has not announced product specifications, pricing or a commercial timetable.