Spirox (TWSE: 3055) hosted the Advanced Packaging Technology Forum in Hsinchu on Sept. 8, 2026, bringing together experts from Corning and DNP to discuss Glass Core, TGV (through-glass via), reliability and inspection technologies for next-generation AI and high-performance computing (HPC) applications. The company unveiled its SP7000G High-Speed TGV Crack Inspection System, which scans a 510 mm × 515 mm glass substrate in less than 20 minutes and detects internal microcracks after metallization and ABF build-up processes. Corning highlighted Spirox’s laser tomography scanning as a non-destructive method for identifying defects inside glass, while DNP emphasized reliability and failure analysis as Glass Core substrates move toward high-volume manufacturing. Spirox said the SP7000G complements its SP8000G system and supports research and development, quality control and high-volume manufacturing.