Samsung Electro-Mechanics and LG Innotek are competing to expand their AI semiconductor package-substrate businesses, showcasing large-area, high-layer-count, glass and FC-BGA technologies at KPCA Show 2026 while developing substrates for Intel's Embedded Multi-die Interconnect Bridge-T (EMIB-T). Rising data input and output from generative AI accelerators is driving demand for substrates that address warpage, signal integrity, heat dissipation and ultra-fine circuits. Samsung presented 2.5D and 2.1D packaging, including bridge embedding and direct redistribution-layer patterning, while LG Innotek debuted large-area FC-BGA substrates, chip embedding and glass-substrate technologies. LG Innotek targets mass production of high-value FC-BGA products by 2027 and glass substrates by 2028. Both companies are also seeking entry into Intel's EMIB-T supply chain: Samsung is developing samples under its 2.1D concept, and LG Innotek has sent samples to SK Hynix for testing with high-bandwidth memory. Google has chosen EMIB-T for its next-generation TPU, slated for release in the second half of next year. The companies face established suppliers including Japan's Ibiden and Shinko Electric, Taiwan's Unimicron and Austria's AT&S, while Ibiden plans an approximately 2 trillion won ($1.5 billion) dedicated Intel production line. KPCA Show 2026 ran from September 9 to 11 at Songdo Convensia in Incheon and attracted approximately 350 companies. LG Innotek's package solutions business recorded 935.6 billion won in first-half revenue and 99.6 billion won in operating profit, and the company aims to reach 1 trillion won in operating profit from the business by 2031. Converting technology development and customer testing into mass production remains the central challenge.