Samsung Electro-Mechanics and LG Innotek are developing and testing package substrates for Intel's Embedded Multi-die Interconnect Bridge (EMIB)-T, seeking entry into a supply chain led by Japan's Ibiden. EMIB-T is an advanced packaging technology that adds through-silicon vias (TSVs), vertical power pathways through silicon, to Intel's EMIB architecture, improving power efficiency and signal integrity for high-performance AI semiconductors. Google has decided to use the technology in its next-generation AI accelerator, the TPU, slated for release in the second half of next year. Samsung Electro-Mechanics is pursuing bridge embedding and direct redistribution-layer patterning under its 2.1D package substrate concept, while LG Innotek has sent samples to SK Hynix for testing with high-bandwidth memory. Ibiden, Shinko Electric, Unimicron and AT&S currently supply EMIB-T substrates, with Ibiden planning an approximately 2 trillion won ($1.5 billion) dedicated Intel production line using an idle fab. Upcoming announcements at the AI Infrastructure Summit in Santa Clara, California, from the 15th to the 17th are expected to offer an indication of future demand, particularly through Google's TPU supply-chain and infrastructure plans.