Advanced packaging thermal report tracks 140 W/cm2 GPU heat fluxes through 2037

Sep 11, 2026 11:46 (42d ago)

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ResearchAndMarkets.com added a report on thermal management for advanced semiconductor packaging.
GPU workloads reach about 140 W/cm2, while 3D packages average nearly 300 W/cm2.
The report provides market forecasts through 2037 in constant 2025 U.S. dollars.

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