Back

Kaifa Technology plans 1.85 billion yuan advanced packaging expansion

Verifying
  • Kaifa Technology plans a 1.85 billion yuan expansion through subsidiary Payton Technology.
  • The project adds 10,000 wafers monthly of 2.5D advanced packaging capacity.
  • Kaifa said HBM technology remained in R&D on June 30.
The information on this website is generated using AI and we cannot guarantee its accuracy. Please use it as reference information only.