TSMC CoWoS capacity set to double to 260,000 wafers by 2028
AI Summary- TSMC is expanding CoWoS capacity across Taiwan and Arizona as AI packaging demand accelerates.
- 130,000 wafers monthly in 2026 is expected to become 260,000 by 2028.
- Intel, ASE Technology Holding, Amkor and Taiwanese suppliers are receiving packaging orders outside TSMC.