ASML has secured adoption commitments for its High NA EUV lithography systems from TSMC, Samsung Electronics and SK Hynix, reducing concerns that the roughly $400 million machines might fail to gain broad industry acceptance. TSMC plans to introduce High NA into volume production from 2030, while Samsung and SK Hynix target 2028; Micron has ordered the equipment without setting a production date. Intel, the earliest adopter, has processed more than one million wafers and used High NA to mass-produce some Core Ultra Series 3 Panther Lake processors on its 18A node. ASML says its existing EUV systems, priced at about $200 million each, are nearly sold out through 2027, while High NA systems are receiving successive volume commitments. The newer systems can print features about 40% smaller than current EUV tools and may reduce multi-patterning requirements. As of mid-July 2026, the global High NA fleet had exposed more than 1.35 million wafers, with the EXE:5200B reaching 135 wafers per hour and fleet availability at 84%. ASML expects availability to reach 90% by the fourth quarter of 2026 and targets 93% over the medium to long term. The company has order visibility through 2028, raised 2026 revenue guidance to €43 billion to €45 billion, and plans 30% capacity increases for Low-NA EUV and immersion DUV systems in both 2027 and 2028. AI-related demand continues to support investment despite a short-term chip-stock sell-off and debate over slowing AI development. Analysts and executives cited in the source say the industry’s long-term expansion remains intact, with major spending plans extending beyond 2028.