SK Hynix maps 3D DRAM strategy as TSMC collaboration draws scrutiny
AI Summary- SK Hynix presented a roadmap for separating 3D DRAM memory cells from peripheral circuitry.
- 3D DRAM would connect separately manufactured components through stacking and fine-pitch bonding.
- SK Hynix and TSMC began formal HBM4 and advanced-packaging collaboration in 2024.