Samsung shifts Cheonan capacity to HBM under 56 trillion won expansion plan
AI Summary- Samsung Electronics is shifting Cheonan back-end capacity from Exynos packaging toward HBM packaging.
- 56 trillion Korean won is earmarked for HBM hubs in Cheonan and Onyang.
- Exynos 2600 packaging will continue in Cheonan, while future models are considered for Onyang.