TTM Technologies will exhibit at electronica India 2026 from September 16–18 at the Bangalore International Exhibition Centre in Bangalore, India. The company will be located at Hall 3, Booth B11, where it plans to present interconnect products and other technologies for AI infrastructure, hyperscale data centers and advanced electronics. Its display will include high-speed printed circuit board (PCB) technology, advanced interconnect and system integration, and next-generation radio frequency (RF) and microwave technologies. TTM will also feature N+M asymmetric PCB technology, which combines different layer configurations within a single board to support signal integrity and power delivery. Laura Woods, Vice President, Corporate Sales & Sales Operations at TTM Technologies, said electronica India offers an opportunity to engage with India’s expanding electronics industry and demonstrate solutions designed to help businesses respond to changing market requirements. TTM’s team will be available throughout the exhibition for discussions about emerging trends and future developments. The company said visitors can schedule meetings through its electronica India 2026 page.