Huawei says domestic AI chip demand outstrips production as it accelerates Ascend roadmap

  • Huawei unveiled more than 10 chipsets for AI computing infrastructure.
  • Ascend 960DT is scheduled for first-quarter 2027, ahead of its previous fourth-quarter timetable.
  • Huawei has shipped more than 1,000 supernode systems to over 370 customers.

Huawei unveiled more than 10 chipsets for AI computing infrastructure, including next-generation accelerators, CPUs and high-speed connectivity chips, as it seeks to reduce China’s reliance on Nvidia and other foreign suppliers. The Ascend 960DT is scheduled for launch in the first quarter of 2027, earlier than the previously planned fourth quarter, while the Ascend 960PR is due in the third quarter. Huawei plans to maintain a one-generation-per-year pace for Ascend products and has outlined Ascend 970 and Ascend 980 releases in 2028 and 2029. The company says domestic demand significantly exceeds supply, limiting international expansion, although it is testing and providing limited supplies to countries with strong demand. Huawei has developed 11 chips around UnifiedBus, its technology for connecting processors, memory, storage and networking hardware in supernode and supercluster systems, and has shipped more than 1,000 supernode systems to over 370 customers. Nvidia shares were quoted at $219.13, up 2.45%, after moving above $218 and approaching $220 resistance. Nvidia continues shipping restricted batches of H200 processors to selected Chinese customers, while analyst Dan Ives said Nvidia remains about 18 months to two years ahead of Huawei and would still be preferred by major Chinese technology companies if available.

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