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Synopsys targets AI chip heat bottlenecks with system-level simulation

Verifying
  • Synopsys combines chip-design and physics-simulation tools in its Multiphysics Fusion workflow.
  • Up to 10x faster design closure is claimed for meeting power, performance and area targets.
  • Samsung Electronics' foundry joined early validation of voltage, thermal and stress effects.
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Synopsys targets AI chip heat bottlenecks with system-level simulation - CoinPost Terminal