Taiwan broke ground on the Baipu Industrial Park in Kaohsiung, where TSMC will build a technology validation laboratory and talent training center for advanced packaging. The two facilities are expected to begin operations in the fourth quarter of 2029. Covering about 88.7 hectares, including 53.6 hectares for industrial use, Baipu will allow equipment and materials suppliers to conduct research, testing and validation alongside TSMC. The project is intended to shorten the path from technology development to mass production and help local companies join the advanced semiconductor supply chain. Taiwan President Lai Ching-te said advanced packaging is increasingly important to competition in AI and high-performance computing, while the government had assessed electricity needs through 2035 and expected to maintain a stable supply. Baipu will complement TSMC’s nearby Nanzih operations and broader investment by companies including ASE Technology Holding and Foxconn in southern Taiwan.