Axcelis Technologies will participate in the 23rd International Conference on Silicon Carbide and Related Materials (ICSCRM 2026) from September 28 to October 2, 2026, at Pacifico Yokohama North in Japan. The company will host Booth #F3 and present research on silicon carbide manufacturing, including substrate implantation, contact engineering, superjunction pillars and high-energy implantation. President and CEO of Axcelis, Dr. Russell Low, said the company will showcase its Purion Power Series+™ platform, an ion implantation system for power-device manufacturing. Ion implantation (using charged particles to modify semiconductor materials) is a key manufacturing step, while silicon carbide (a compound semiconductor used in power electronics) is estimated by Yole Group to become an $11 billion market by 2031, growing at a 20% CAGR from 2025 to 2031. Axcelis, headquartered in Beverly, Mass., has supplied semiconductor-industry solutions for nearly 50 years.