Hanmi Semiconductor has supplied its first FC Bonder 75 2.5D packaging system to an overseas customer, expanding beyond high-bandwidth memory (HBM) manufacturing equipment into equipment for assembling AI system semiconductors. The machine supports large 75mm × 75mm connection plates used to arrange GPUs and HBM in a single package. Hanmi has introduced several related systems this year, is preparing the 2.5D TC Bonder 120, and established its U.S. subsidiary Hanmi USA in October to respond to customer demand. Its broader lineup can serve foundries, semiconductor assembly and test (OSAT) providers and AI semiconductor companies, while the company expects U.S. packaging-equipment demand to increase around 2028 as major production facilities begin full-scale operations.