Alibaba introduced the Zhenwu V900 at its annual Apsara Conference, advancing its push for AI-chip self-reliance as Tencent and Huawei also announced new AI products and accelerated roadmaps. Developed by Alibaba’s T-Head semiconductor unit, the V900 delivers three times the performance of its predecessor, includes 216 gigabytes of high-bandwidth memory and can be linked in clusters of up to 500,000 chips, Alibaba CEO Eddie Wu said. Mass production and commercial release are scheduled for the first quarter of 2027. Alibaba plans to invest more than $53 billion in AI infrastructure and development over three years, develop Qwen models with 5 trillion to 10 trillion parameters, and expand Alibaba Cloud’s global data-center capacity beyond 20 gigawatts by 2032. Tencent unveiled its Hy-Image-3.5-Preview image-generation model and said it plans to deploy AI agents through its Yuanbao chatbot and WeChat ecosystem, while Huawei accelerated plans for Ascend 960 training and inference chips. The announcements helped lift investor sentiment toward Chinese AI companies, with Tencent shares rising 6.6% in Hong Kong trading.