SK hynix received TSMC’s Partner of the Year award for the second consecutive year at the Sept. 23 TSMC Open Innovation Platform Conference in Santa Clara, California, recognizing joint validation of HBM5 using TSMC’s 2.5D CoWoS advanced packaging technology. The company also showcased NVIDIA’s next-generation Vera Rubin superchip with 12-layer 36GB HBM4 and 96GB SOCAMM2, alongside server DRAM and enterprise SSD products. SK hynix projected that PCI Express-based enterprise SSD demand would increase from 509 exabytes in 2026 to 1,933 exabytes in 2030 as AI infrastructure expands. Its shares in Seoul closed Sept. 28 down 5.1%, while a GuruFocus GF Value graphic estimated the stock at a 44.98% premium to its estimated value, with one warning sign flagged.