Taiwan Semiconductor Manufacturing (TSMC) is reportedly seeking to build five additional advanced packaging plants at the Chiayi Science Park in southern Taiwan. The additions would bring its total at the park to 10 and, if completed, create what reports describe as the world’s largest and most technology-intensive advanced packaging hub. TSMC is expanding capacity to address rising demand from Nvidia, AMD and Apple for its Chip on Wafer on Substrate (CoWoS) technology, which integrates AI chips with high-bandwidth memory. The proposed expansion follows Taiwan’s plans to develop the site and attract related technology companies.